Overview:

 
Compact, powerful and extremely wide scalable modular platform for Computers-on-Modules (COMs) based onX86 architecture.
 

Concept:

  • CPU module with standard PC core functions
  • Carrier board with customer specific functions & size
  • Logical alternative to a chip-down design effort

Benefits:

  • Faster time to market
  • Reduced development costs
  • Scalable product range
  • Allows customer focus on system features
  • Faster reaction to market trends
  • Second source philosophy
  • Minimize inventory cost
  • Extreme scalability and flexibility
  • Widest market acceptance
  • Highest performance and bandwith of all COM standards
  • Multiple, mount and plug compatible form factors
  • Choice of different pinout types
 

We simplify the use of embedded technology.

types:

 Type 2 Type 6Qseven XTXETX
PCI Express6 84 4-
PEG Port1 11 --
SDVO 2 1 2 - -
DDI (Digital Display Interface) 0 3 - - -
USB 2.0 8 4 8 6 4
USB 2.0&3.0 4 4 - - -
PCI Bus 32 Bit 1 - 1 1 1
IDE 1 - 1 2 2
Ethernet 1 1 1 1 1
SATA 4 4 4 4 -
LVDS 1 1 1 - -
VGA 1 1 1 1 1
CAN - 1 - - -
HDA (High Definition Audio) 1 1 1 1 -
GPIO (General Purpose Input/Output) 8 8 8 - -
SDIO 0 1 - - -
SM Bus 1 1 1 1 1
I2C Bus 1 1 1 1 1
Serial - - - 2 2
LPT / Floppy - - - 1 1
TV Out - - - 1 1
LCD - - - LVDS or TTL LVDS or TTL
LPC Bus - - - 1 -
Fan Control - - - 1 -
ISA Bus - - - - 1
Audio In/Out/Mic - - - 1 1
       

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